Showing product results. 1 - 15 of 53 products found.
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CP Series - Electrogrip Company
'CP' electrostatic chucks all employ a Chuck Puck, bolted onto a Service Base. Standard CP chucks operate between -60 and +120 deg. C.
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ARC Technologies
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Electrogrip Company
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Fraunhofer-Gesellschaft
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Electrogrip Company
Electrogrip is able to grip through one substrate to grip a second masking substrate.
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Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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A-Series - Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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C-Series - Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Electrogrip Company
Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Electrogrip Company
High temperature electrostatic chucks are available for the ranges -60 to +400 deg. C, and for 350 to 600 deg. C. Different materials and constructions are used in these two ranges.
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Shimadzu Corp.
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Model 640 - TREK, INC.
Trek’s Model 640 Electrostatic Chuck Optimizer system is a diagnostic tool which enables evaluation and optimization of waveforms/voltages for electrostatic chucks/clamps in order to minimize de-clamp time, maximize clamp force, and achieve optimum wafer processing for ESC systems. Model 640 combines two amplifiers (for two-phase voltage combinations) and a waveform generator, which can be independently programmed and configured to investigate, research, and discover the perfect power supply and waveform recipe to efficiently drive an ESC application. An electrostatic voltmeter (ESVM) is included to monitor residual voltage from the clamping/de-clamping process.
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FC150 - ARC Technologies
Hybridization or chip-stacking is a popular technology when numerous connections need to made between two semiconductor chips such as an Infrared Focal Plane Arrays (IrFPA) and its Read-Out Integrated Circuits (ROIC). As an example a 640 x 512 Focal Plane Array would have 328,000 photo diode pads that must be connected to corresponding pads on the ROIC. One industry standard tool for accomplishing this bonding with excellent positional accuracy (±1um), calibrated thermal and pressure is the FC150 shown below in Figure 1.
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L-Series - Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
