- InterWorking Labs, Inc.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis
Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis Services
Introducing our Failure Analysis services partner, close neighbour and collaborator NanoScope Services. Working together with NanoScope we offer the following portfolio of advanced FA services.
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Failure and Technology Analysis
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Fatigue Failure Tester
EKT-2002FF
EKT-2002FF Flexing Fatigue Tester is designed in accordance with ASTM D4482 to test the fatigue life under a tensile strain cycle on different kinds of vulcanized rubber compound to determine the fatigue life at various extension ratios.
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Partial Load Failure
PLF Device
The control device series “PLF” has been designed to monitor the partial and/ or total failure of the alternating current absorbed by loads driven by static switches and / or electromechanical relays.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Electronics Failure Analysis System
Sentris
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Failure Analyziz and Quality Assurance
NX20
There's no room for error in the data provided by your instruments. Park NX20, with its reputation as the world's most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of gr...show more -
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Materials, Structure, Surface, and failure analysis Services
Materials Analysis Technology Inc.
MA-tek provides wide span of materials analysis, structure analysis, surface analysis, and failure analysis. By technology segment, MA-tek provides 9 major service lines:1. Electrical Failure Analysis (EFA). 2. Physical Failure Analysis (PFA). 3. Structure Analysis. 4. Surface Analysis. 5. FIB Circuit Editing6. Reliability Testing. 7. Reverse Engineering of Benchmark Analysis. 8. IP Consultancy. 9. Quality Management Training Course.
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1HZ~100MHZ Crystal Oscillator Tester
CX-118A
Shenzhen Chuangxin Instruments Co., Ltd.
1 It's using reciprocal counting technique, high accuracy, wide measuring range, truly equal precision measurement, fast speed measurement, high sensitivity.2 single-chip microprocessor technology cycle frequency measurement and intelligent management, making the instrument has high reliability and excellent performance / price ratio.3 It's using LSI design, the use of CPLD devices, instrument components greatly reduced, reliability has been greatly improved, the average time between failures ≥10000h.The machine looks nice, small size, light weight, easy to use.
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2 Ch Linear Vibration Motor Tester
BK2120C2
If it's not broke, break it. And when our BK2120C was a top selling product, we redesigned it. We took all the feedback from our customers and implemented it with a modular design to come up with a system that is more versitile, easier to use, and easier to set up. The core concept is the same; the BK2120C runs up to 4 vibration sweeps, which you define, to check whether your linear vibration motor is within the limits you set. And now you can set up your own feedback so it's even easier to dete...show more -
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2 Ch Linear Vibration Motor Tester
BK2120C
the BK2120C runs up to 4 vibration sweeps, which you define, to check whether your linear vibration motor is within the limits you set. And now you can set up your own feedback so it's even easier to determine the class of pass or the reason for failure. You still get fast, high quality testing for your linear vibration motors on the product line. And it's still versitile enough to be used for QA or QC as well.
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2-CH PCI Express® 10 GigE Vision PoE+ Grabber
PCIe-10GPoE
ADLINK's PCIe-10GPoE PCI Express® PoE+ frame grabber supports 2-CH independent Gigabit Ethernet ports for multiple GigE Vision connections transferring up to 10Gb/s per port. PoE+ provides up to 30W power and automatic detection for stable, reliable connections, reducing costs, simplifying installation, and easing maintenance burdens. Exclusive comprehensive PoE Protection secures assets prevents overcurrent and overvoltage avoiding equipment damage. Smart PoE Management, easy-to-use utility and...show more -
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2 phase 120/240VAC SDP-30KW split phase inverter
SDP-30KW
Zhejiang Sandi Electric Co., Ltd
SANDI SDP series Pure Sine Wave Inverter is the one of the most advanced technology DC to AC conversion products in the world, it’s suitable use for areas without electricity, providing a complete power solution for strict demand applications. With SVPWM technology it has high conversion efficiency, high instantaneous power and low losses power output pure sine wave, applying to capacitive, inductive and nonlinear mixed-load, with superior load capacity, perfect protection function: overload, sh...show more -
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40 Mm Beam Pitch General Purpose Area Sensor
NA40
Panasonic Industrial Devices Sales Company of America
The NA40 General Purpose Area Sensor from Panasonic offers a slim body design, failure monitoring and easy modification of length with robust aluminum enclosure.
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5L Oxygen Concentrator
OxyTec-5S
The Oxytech 5S is an advanced oxygen therapy solution that provides its users with a higher standard of care. -Emphasis on Safety, High/Low Flow, High/Low Pressure, Low Oxygen, Power Failure alarms. Advanced, optional Monitoring Capabilities. -Ease of maintenance, convenient access or filter cleaning: due to its unique design, awarded with a Certificate of Design Patent. -Optimum patient comfort, due to its easy to use design, features and operation. -Lightweight (only 15.9 kg), quiet (less than...show more -
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650nm Visual Fault Locator
Shanghai Baudcom Communication Device Co.,Ltd.
Visual Fault Locator series Visual Fault Locator uses the DFB-LD as the emitting component. Driven by constant current source, the indicator can emit stable red laser.The product can be used to inspect fiber failure when they connect with optical interface and be inserted into single mode or multi mode optical fiber.It is indispensable tool in fiber project constructing, fiber net-work maintaining, optical component manufacture and research.
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6 Chip Detection and Burn Channels
CD1
The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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8-Port Junction Box
Teledyne Marine Cable Solutions
A heavy-duty junction box designed for use in high-risk environments where the cost of failure is significant.
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ACB Inspection system
XT V 160
The XT V 160 is specifically designed for x-ray inspection in production lines and failure analysis laboratories.
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Accelerated Product Life Cycle
Delserro Engineering Solutions
Under normal conditions it may take years to gather failure data on the life cycle of new products. Through accelerated life testing the overall time to failure can be reduced to weeks by increasing the frequency of the field loads and by removing insignificant stress components. In addition, life cycle testing on a product can be reduced or accelerated dramatically by increasing the stress levels to higher than normal. Putting a product through Accelerated Life Testing can reduce test time from weeks to days while still achieving satisfactory results saving both time and money.
