Copper Diffusion TestSystems

Materials Development Corporation (MDC)

MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software.  This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employs
copper as a conductor.  Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.
Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded.  The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.