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- Pickering Interfaces Inc.
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Serial AC Power Sequencer
90-200-001
Each power outlet can be programmed to switched on in sequence with a specific timing delay. The delay can be staggered to ensure that order dependent systems - like PXI - can be switched on and off in an orderly way with just one operation. A staggered start up also limits the inrush current associated with the powering up of equipment, including earth current inrush, placing less stress on cabling and leakage breakers. Power on or off instructions can be initiated from either the front panel switch or via the serial interface.
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Heat Stress
Our lineup of heat stress meters include the WBGT (Wet Bulb Globe Temperature) meters, which provides the most accurate determination of the heat stress index based on the cumulative effect of air temperature, air movement, relative humidity, and radiant heat.
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Heat Stress Monitors
Heat stress management is often viewed as time-consuming and complex. Simplify your heat stress management with TSI’s intuitive QUESTemp° Series Heat Stress Monitors.
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Heat Stress Monitors
Heat stress management is often viewed as time-consuming and complex. Simplify your heat stress management with TSI’s intuitive QUESTemp° Series Heat Stress Monitors.
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Environmental Stress Screening
ESS
Environmental stress screening (ESS) is also known as Burn-in, AST (Accelerated Stress Testing), HALT (Highly Accelerated Stress Test), or HASS (Highly Accelerated Stress Screening). Whatever the name, the idea is the same: create a test program that allows you to eliminate the infant mortality of your product.
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Shear Stress Sensors
DirectShear™
Micromachined floating element shear stress sensor that enables time-resolved, one-dimensional, direct shear stress measurements. Direct measurement of shear stress — no heat transfer calibration. Non-intrusive — minimal flow disturbance. Simultaneous mean and fluctuating shear stress measurements. High resolution, dynamic range and bandwidth. Highly accurate, quantitative measurements.
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Heat Stress Meters
The heat stress meter is mainly used in the workplace. The heat stress meter can detect and classify temperature in relation to the amount of moisture content. What is heat stress? And why is heat stress measured? People who work in installations or with machines that produce a lower energy level or a high emission of temperature can occasionally suffer heat stress (by the influence of body temperature). This phenomenon can also cause physiological symptoms: spasms, feeling unwell and shock that can in some cases prove fatal.
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Stress Test Software
PassMark BurnInTest
PassMark BurnInTest? is a software tool that allows all the major sub-systems of a computer to be simultaneously stress tested for endurance, reliability and stability.
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Stress Hysteresis Measurement
500 Series
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in air.Non-Contact Laser Scanning Technology.
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Encoder Stress Pattern
ESP™
SRI's ESP is a sophisticated video clip consisting of specialized and complex artificial test patterns that stress various aspects of processing to quickly reveal television encoder deficiencies. Its unique motion sequences allow users to visually evaluate and objectively compare the quality and performance of standard- and high-definition encoders.
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Environmental Stress Screening
E.S.S
King Design Industrial Co., Ltd.
E.S.S system could find most potential and hiding defects earlier by checking the physical property of allmaterials and components, and make use of their nature response under Environmental Stress. Through our screening will to pick out all potential and hiding defects in advance and improving the product's reliability inling. It benefits the manufacturer and customer mutually.
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Stress Testing System
Load Dynamix
LoadDynamix (former Swifttest) is famous for its IP based converged storage system stress testing, including iSCSI, SMB/CIFS, NFS, FC and HTTP/HTTPS based storage systems. Its GUI interface is very easy to use and allow customer engineer to fully configure all the parameters at the protcol layer. Nearlly all the major IP storage system manufacturers have LoadDynamix products in their test lab.
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Board Stress Analysis
Board stress analysis is an increasingly critical part of the test fixture build process today. Probe densities under BGA devices put tremendous pressure onto the solder joints of these devices. If the fixture is not designed properly, immediate damage can occur to the BGA’s, or even more devastating, future damage, which creates field failures. We can provide strain testing before shipping your fixture to insure that there are not excessive forces placed on your BGA parts. With the use of National Instruments Strain equipment, and tri-directional rosettes, we cycle test the board/fixture and measure and record the amount of strain from each corner of each BGA. Any over limit conditions are corrected before shipment. This service insures that your products will not be damaged at ICT, and help to reduce field failures from damaged components, compromised solder joints, or lifted pads.
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Plant Stress Kit
PSK
The Y(II) meter was designed to provide an inexpensive way to measure the fast light adapted Y(II) or F/FM' protocol and to make it available to more people that need it.
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Structural & Stress Analysis
Structural analysis is critical because it can determine cause and predict failure – evaluating whether or not a specific structural design will be able to withstand the external and internal stresses and forces expected for the design.
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Backgrinding & Stress Relief
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
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Strain & Stress Testing
DATASYST Engineering & Testing Services, Inc.
Using strain gaging and analysis, Datasyst can assist you in quantifying strains so you can improve your product design.
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Local and Lattice Stress Measurement
127 Raman
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
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Optical Receiver Stress Test
N4917BACA
A complete, automated, and repeatable solution for optical receiver stress test.
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Accelerated Stress Test Chamber
CSZ's accelerated stress test chambers combine mechanical refrigeration; LN2 cooling and high velocity air flow for fast product temperature change rates. Chambers are typically designed with a change rate up to 30C (54F) per minute based upon the part temperature. Common uses are production stress testing circuit boards, electronic drives, assemblies, etc. Design allows the user to quickly control and change the temperature of the product.
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ESS Environment stress screening
Temperature adaptability test under the condition of rapid change, or gradient for electrical, electronic, instruments and other products or spareparts, particularly applies to environmental stress screening test（ESS）
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Mechanical Stress Card Testing
Wheels are transversely positioned with micromechanical stopsPressure exercised on the card's chip and microcircuitryThe card is free to deform in the Z axisThe stress is controlled by an accurate, precise force sensorProgrammable number of cycles
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Optical Receiver Stress Testers
Developing next-generation optical receiver technology requires world-class stress testing. Use Keysight's automated calibration solution and get optical stressed eye results in one-tenth the time compared to a manual setup.
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Creep and Stress Rupture Tester
QualiCreep Series
Qualitest Creep and Stress Rupture Tester - QualiCreep Series is mainly designed to perform Creep and Stress Rupture testing of a wide variety of materials to both standard and customized specifications such as ASTM E139, ISO 204, ISO/R 206 and similar international standards. These machines are capable of covering the determination of the amount of deformation as a function of time (creep test) and the measurement of the time for fracture to occur when sufficient force is present (rupture test) for materials when under constant tensile forces at constant temperature. Qualitest offers three models electronic high temperature creep-testing machine with full closed-loop servo-control in capacities from 10kN to 500kN.
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Burn-in and Stress Screening Chambers
KDR
Supervise the operation of your product, electronic device, circuit board, or medical device while they are stress screened, burned-in, or temperature cycled inside a Bemco Kardburn or Koldburn glass front chamber. With a huge amount of testing or storage space within instant reach, KD Chambers provide a compact and attractive alternative to a walk-in chamber.
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OM Thermal Stress System
Conductor Analysis Technologies, Inc
The OM Thermal Stress System is a cost-effective performance based reliability test methodology which performs convection reflow assembly simulation and air-to-air thermal cycling. The methodology is utilized by both the IPC PCQR and the IPC 6012-QLM programs. OM systems are available for sale or lease, and test services are provided from both CAT and our service partners.
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Heat Stress WBGT Meter
Heat Stress Index measures how hot it feels when humidity iscombined with temperature, air movement, and radiant heat Black Globe Temperature (TG) monitors the effectsof direct solarradiation on an exposed surface Air Temperature (TA) plus Relative Humidity (RH) Selectable units of F and C In/Out Function displays the WGBT value withor without direct sun exposure Auto Power Off with override Built-in RS-232 interface with optional Windowscompatible software Complete with two AAA batteries
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Stress Analysis Strain Gauge
Structures can, and do, break, and this may be important and sometimes dramatic. It’s critical to determine whether a particular object made from a particular material can carry a particular load. If a true stress is ignored, the cost of not acting is usually far higher than the cost of dealing with the problem earlier. A well-done strain measurement will produce an accurate representation of the strain actually present under the sensor. Strain data, however, is seldom gathered as a means unto itself. It is usually little more than a convenient vehicle for indirectly obtaining information about some other engineering parameter.
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Stress Analysis Strain Gages
Bondable foil strain gages (strain gauges) available in thousands of possible pattern designs and combinations of grid alloys, backing materials, resistances, and options.
