Moisture Resistance
IPC/JEDEC J-STD-020D.1 - National Technical Systems (NTS)
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage ”cracks and delamination” from the solder reflow process. This document describes the standardized Moisture Sensitivity Levels (MSL) of floor life exposure for moisture/reflow-sensitive SMD packages along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures. Companion documents J-STD-020D.1 and JEP113 define the classification procedure and the labeling requirements, respectively.
