Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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Frame Grabber
Alta-AN
The Alta-AN is an affordable, versatile analog product family for Semiconductor and Industrial Vision OEMs. This family can acquire from almost any analog camera on the market, from high speed asynchronous-reset monochrome cameras to super high resolution color HDTV cameras. The Alta frame grabbers are high-quality, flexible, PCI Express bus imaging products, well supported by an easy-to-use SDK, and drivers for most popular software imaging packages.
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Semiconductor Inspection (SEMI)
A process for detecting any particles or defects in a wafer.
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Pulsed IV Systems
AM3200-Series
AMCAD Engineering has created professional, industry-proven pulsing technology for both standalone IV-testing (Pulsed IV, PIV) as well as pulsed-bias load pull (Pulsed Load Pull, PLP) and high-voltage power semiconductor applications. Systems come equipped with a mainframe controller which includes integrated power supplies. Input and output pulser modules (probes, pulsers) are selected for specific applications and are available in bipolar ±25V/1A and high-voltage 250V/30A models.
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Scanning Magnetic Microscope
Circuit ScanTM 1000
Operating circuits within a semiconductor generate external magnetic fields near the surface of the device. These magnetic fields, while weak in strength, contain information about the spatial variation of current density flowing within the circuit. Micro Magnetics has developed the CS1000 to make practical use of this information and provide engineers with valuable information about what is going on inside circuitry non-destructively.
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14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Industrial Resistivity Meter
HE-480R(W)
The HE-480R industrial resistivity meter features the high-precision temperature compensation function.Its high-performance temperature compensation makes it ideal for sequential monitoring of ultra-pure water used in manufacturing processes in the semiconductor field, and many other fields, including the areas of electrical goods, foods and medicines. The measurement range is from 0 to 100.0 MΩ・cm.
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Spread Resistance For Slanting Polished Sample Of Semiconductor By Tow Kinematically-mounted Probe Contacting .
SRS-2010
*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
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Surface Analysis
Shimadzu offers a range of instruments that are ideal for all sample forms handled by customers in the fields of steel, non-ferrous metals, environment, foods, chemicals, pharmaceuticals, semiconductors, ceramics, and polymers. EPMA/SEM offers analysis of targets from several centimeters to several microns; XPS offers analysis from several millimeters to several microns; and SPM permits observations from over a hundred microns to several nanometers.
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Test Management Software
ActivATE™
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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LXI High Voltage Matrix 2-Pole 100x2
60-310-102
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing. The 60-310 is designed in accordance with the LXI Standard 1.4 and is supplied in a 2U high, full rack width case with 500mm depth.
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Dicing Machines
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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DC Bias Injector
J2130A
When using the network analyzer to measure impedance, such as the capacitance and ESR or a capacitor, or the DCR of an inductor, etc., it is often necessary to provide a voltage bias to the device being tested. This is true of semiconductor junction capacitances, varactors, and some ceramic capacitors (especially X5R). In these cases the impedance is a function of the DC bias on the device. The Picotest DC bias injector (J2130A) is used for this purpose during impedance measurements.
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Bow and Global Film Stress Measurement
128 Series
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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Package Inspection Products
Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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Power Amplifiers
RPG Medium Power Amplifiers are developed and manufactured by using most modern discrete components and thin film technologies, in order to cover the frequency range 50 to 130 GHz. With improved DC-supply and modern semiconductors these medium power amplifiers not only deliver high power output but also superior power added efficiency (PAE) and higher linearity. These medium power amplifiers are available as a standard product and on request as a customized manufactured product..
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Desolvating Nebulizer
Aridus3
The CETAC Aridus3 Desolvating Nebulizer System is a specialized liquid sample introduction accessory for inductively coupled plasma mass spectrometry (ICP‑MS). The Aridus3 can enhance analyte sensitivity up to 10 times or more and can greatly reduce solvent-based interferences such as oxides and hydrides.The Aridus3 couples a low-flow (50, 100, or 200 µL/min) PFA nebulizer and a heated PFA spray chamber with an inert fluoropolymer membrane. This combination provides enhanced analyte sensitivity while reducing solvent based interferences such as oxides and hydrides. The Aridus3 is particularly advantageous for small volume and highly corrosive samples such as those generated in the earth sciences and the semiconductor industry.
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13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Laser Head
5517FL
The Keysight 5517FL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Power Semiconductor Device
IGBT/SIC
Hitachi High Voltage IGBTs have been corresponding to a wide range of applications such as railway applications and various power conveters, leading companies for domestic and overseas adopt them, since they were adopted as a railway application in 1992. Will continue to contribute to the developing energy society by pursuing more easy-to-use, high-performance and high -quality products with leading-edge research and development.
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5G Testing
Teradyne test solutions are at the forefront of the 5G test era. Why? We work with the leading semiconductor manufacturers and provide optimized test coverage for the major wireless standards. From emerging millimeter wave devices to the traditional sub-6GHz, our test solutions are already leading the way.
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Copper Diffusion TestSystems
Materials Development Corporation
MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software. This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employscopper as a conductor. Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded. The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.
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Moisture Analyzer
5800
The 5800 is ideal for high-purity gas production, semiconductor gases, and the production, storage and transmission of olefins. It is suitable for use in industries including hydrocarbon processing, industrial gas and semiconductors.
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RF & Microwave Signal Generator
SMA100B
The R&S®SMA100B RF and microwave signal generator delivers uncompromising maximum performance. It provides the purest output signals while maintaining the highest output power levels with the lowest harmonics, far outpacing the competition. As the world's leading signal generator, it can handle the most demanding module and system T&M tasks in the RF semiconductor, wireless communications, aerospace and defense industries.
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TLP Tester
Tokyo Electronics Trading Co., Ltd.
A method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures.
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Variable Angle Spectroscopic Ellipsometer
VASE
The VASE is our most accurate and versatile ellipsometer for research on all types of materials: semiconductors, dielectrics, polymers, metals, multi-layers, and more. It combines high accuracy and precision with a wide spectral range up to 193 to 2500nm.
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Test Software
American Probe & Technologies, Inc.
This new series of software allows you to analyze materials or semiconductor leakage with all of the capabilities of your HP 4140B to resolutions of 1 fA @ 100VDC. Completely rewritten in Visual Basic for Windows XP operating system, it offers Virtual Front Panel Operation of 4140B for I-V & CV Analysis and allows operator to virtually control the 4140B for any instrument operation. I-V Plots with options of displaying current over time. CV Plots with high resolution plotting capability.
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Laser Diode
Is an electrically pumped semiconductor laser in which the active laser medium is formed by a p-n junction of a semiconductor diode similar to that found in a light-emitting diode.
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Ultrasound Transducers
Utilizing optical and semiconductor fabrication techniques, Imaginant manufactures the PureView PrecisionTM line of RoHS-compliant delay-line ultrasound transducers with center frequencies ranging from 50 MHz to 250 MHz (higher and lower transducer frequencies are also available). Imaginant's precision-manufacturing process produces transducers that exhibit high reliability and high uniformity from device to device. This manufacturing consistency enables uniform test system performance to be attained across multiple systems. Imaginant transducers are available in focused and flat-face models that can be produced with minimal-damping for applications requiring maximal sensitivity or with maximal-damping and high-bandwidth for applications requiring the highest-degree of temporal precision.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
