Solder Paste Inspection – SPI

S3088 SPI - Viscom AG

*Precise control of all essential 3D features; calibration-free.
*Extremely high throughput due to FastFlow Handling.
*Integrated height tracking.
*Viscom Quality Uplink: process optimization and first-pass yield increase.
*Simple process analysis with the Viscom Uplink Analyzer.
*Fast program generation.
*Print optimization through interlinkage with printer (closed loop).