Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series - ADLINK Technology Inc. (ADLINK)
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Expandable Fanless Embedded Computers
ADLINK's MXC product line provides fanless embedded computers for high-performance embedded solutions. Leading the field, high-performance computing power combines with PCI/PCIe high-speed expansion slots in a compact enclosure fully enabling integration of a variety of applications.
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Edge AI Platforms
ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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IPC Systems
Industrial Server-Grade System delivers a scalable high performance platform for a wide array of industrial applications.
