Axic Inc.
Axic, Inc. was founded in 1980 as a company to develop surface science equipment for the semiconductor, electronics, and general scientific community.
- 800-475-2762
408-980-0240 - 408-980-0524
- sales@axic.com
- 891 Ames Ave
Milpitas, CA 95035
United States
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Applications
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product
Multichamber PECVD/Etch System
IsoLok 5000
Load locked cluster toolCassette to cassette processingUp to 4 coatings can be deposited without breaking vacuumSubstrate sizes: 125 x 125mm,156 x 156mm and200mm dia. (smaller sizes can be processedusing a carrier)Typical coatings: SiOx & SiNx - doped & undoped & a- SiR&D, Pilot production and production capabilitiesRIE chambers availableFull computer controlProcess chamber is modular and interfaced with 200mm slot valve
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Thin Film Composition and Thickness Monitor
P-1000
The Precision P-1000 readily analyzes compound thin films utilized in semiconductor, superconductor, magnetic and applications.
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Plasma Processing Systems
PlasmaSTAR
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.