VIEW Micro-Metrology
VIEW Micro-Metrology produces high accuracy, visible light microscopy systems for critical dimension and coordinate metrology applications in the semiconductor, MEMs, Data Storage, Display and Solar Junction industries.
- 800-SOS-VIEW
480-295-3150 - 480-889-9059
- info@viewmm.com
- 1711 West 17th St.
Tempe, AZ 85281
United States
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Compact Design Measurement System
Benchmark 450
The Benchmark's fixed bridge design separates the X and Y axis motions, allowing each to operate without any influence on the other. This arrangement provides the maximum mechanical integrity and accuracy in the stage motion. The bridge type design also makes loading and unloading of large parts more efficient, and helps to minimize the overall footprint of the system.
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Dimensional Measurement System
MICROLINE AF
The VIEW MicroLine® is a high-performance critical dimensional measurement system for wafers, masks, MEMS and other micro-fabricated devices in situations which do not require fully automated operation.
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Dimensional Metrology System
PINNACLE PLUS
Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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Dimensional Metrology System
SUMMIT
The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
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Key Technologies
VIEW systems are designed for measurement of parts and assemblies with complex dimensions and a high density of features. They include the most advanced QVI technologies for high accuracy, repeatability, and throughput.
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Software
Metrology systems vary significantly in their utility, which is largely a function of software. The software ultimately determines what the system can do, and if certain capabilities, commands, or calculations are absent, it can severely compromise productivity.
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Applications
No matter what the requirement for ultra high-precision measurement, VIEW has the ideal solution. VIEW non-contact measurement systems utilize sub-pixel image feature detection with either field-of-view (FOV) or point-to-point (PTP) configurations for exceptional accuracy and repeatability. From etch-dimensions on hard disk drive (HDD) heads to semiconductor overlay measurements, we provide the accuracy you need for quality manufacturing.
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Compact General-Purpose Metrology System
Benchmark 250
The Benchmark 250 is a compact general-purpose metrology system with all the features and capabilities of the larger VIEW Micro-Metrology models. With travel of 300 x 150 x 150 mm, the Benchmark can accommodate a wide range of part sizes, and is rugged enough to be located in either a Q/A lab or an inspection station on the production floor.
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Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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Optical Metrology System
BENCHMARK 300
The VIEW Benchmark™ 300 is engineered for high performance and reliability in a floor model package. Advanced optics, illumination, image processing, and available Continuous Image Capture make VIEW Benchmark a world-class metrology system.
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High Accuracy Dimensional Metrology System
Pinnacle 250
The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring.
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Critical Dimension Measurement System
MicroLine® Series
The MicroLine series of non-contact critical dimensional measurement systems are ideal for semiconductor and MEMS applications. MicroLine systems automatically measure linewidth, overlay, and other critical features on wafers and photomasks. Systems are capable of measuring features from 0.5 m to 400 m in size. Measurement repeatability is 10 nm at 1 s (with 100x objective).