Alto Inspection Corp.
Based in Silicon Valley, California, Alto Corporation is founded by a team of multi-discipline technologiests to research and develop the nano-scalre metrology and inspeciton solutions for semiconductor in-line production especially in the sapphire wafer, coumpound or exotic wafer and MEMS (Micro-Electro-m=Mechanical Systems) segments.
- +1-408-307-5209
- 1-408-727-2055
- info@altoinspection.com
- 2130 Ringwood Ave
San Jose, CA 95131
United States
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product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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product
Monitroing and Control
THANKS TO OUR ADVANCED DATA ANALYSIS FUNCTION AND EASY-TO-VIEW USER INTERFACE, YOU CAN IMPLEMENT SPC WITH VERY LITTLE EXTRA WORK. OUR MONITORING SOLUTION IS DESIGNED TO IMPROVE THE TRACKING THE DEFECT AND CAN BE EASILY CORRELATED WITH YOUR MANUFACTURING PARAMETERS FOR ROOT-CAUSE ANALYSIS.
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product
Non-contact Film Thickness Measurement
ALTO-IRT-7000
ALTO-IRT-7000 (IMPEDANCE RESONANCE TECHNOLOGY ) FILM THICKNESS METROLOGY TOOL UTILIZES NON-CONTACT CAPACITIVE AND EDDY CURRENT TECHNOLOGY TO ANALYZE MICRO SECTORS ON COATED SURFACES THAT ARE 1000 TIMES SMALLER THAN ANY COMPARABLE EDDY CURRENT PRODUCTS. BUT MOST IMPORTANTLY, THIS UNIQUE IRT TECHNOLOGY ALLOWS FOR SOPHISTICATED ANALYSES OF THE CONTINUOUS AND DISCRETE FILMS BELOW 50 ANGSTROMS, DRAMATICALLY IMPROVING THE ACCURACY OF QUALITY CONTROL READINGS.
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product
Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
